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IRepair MS1 Mijing Hollow Version Intelligent Desoldering Preheating Platform for iPhone 11–17 Pro Max
Professional Mijing MS1 intelligent preheating platform for precise iPhone 11–17 Pro Max motherboard desoldering and repair.
Original price was: ₨60,000.00.₨55,000.00Current price is: ₨55,000.00.
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Features & Compatibility
The IRepair MS1 Mijing Hollow Version is a professional intelligent desoldering and preheating platform designed for iPhone 11–17 Pro Max motherboard repair. It features rapid heating, accurate temperature control, and a hollow heating module for safe and efficient layer separation. Ideal for mobile repair technicians and service centers.
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